SENSOR CONFIGURATION FOR PROCESS CONDITION MEASURING DEVICES
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United States of America Patent
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Issued Date -
Jun 16, 2022
app pub date -
Dec 3, 2021
filing date -
Dec 3, 2021
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Abstract
A process condition measurement apparatus is disclosed. The apparatus includes a substrate, one or more insulation portions, a first plurality of interconnect traces, a second plurality of interconnect traces, and a plurality of sensors disposed on the substrate. The second plurality of interconnect traces is disposed over the first plurality of interconnect traces and intersects at a plurality of locations to form a matrix of interconnect junctions across one or more locations of the substrate. A respective sensor is electrically coupled to a respective trace of the first and second plurality of interconnect traces. The respective sensor is individually readable by addressing the respective trace of the first and second plurality of interconnect traces.
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