SEMICONDUCTOR CHIP INCLUDING CHIP PADS OF DIFFERENT SURFACE AREAS, AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 2, 2022
app pub date -
Oct 11, 2021
filing date -
Oct 11, 2021
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A semiconductor chip includes a chip body including a signal input/output circuit, a chip pad structure disposed on a surface of the chip body, the chip pad structure including first and second chip pads, the two chip pads having different surface areas, and a chip pad selection circuit disposed in the chip body and electrically connected to the signal input/output circuit and the chip pad structure. The chip pad selection circuit is configured to selectively and electrically connect one of the first and second chip pads to the signal input/output circuit.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully