SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Jun 2, 2022
app pub date -
Apr 26, 2021
filing date -
Apr 26, 2021
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Abstract
A semiconductor chip includes a chip body including a signal input/output circuit unit, a chip pad unit disposed on one surface of the chip body and including first and second chip pads having different surface areas from each other, and a chip pad selection circuit unit disposed in the chip body and electrically connected to the signal input/output circuit unit and the chip pad unit. The chip pad selection circuit unit is configured to select one chip pad of the first and second chip pads and electrically connect the selected one chip pad to the signal input/output circuit unit.
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