BARRIER RUTHENIUM CHEMICAL MECHANICAL POLISHING COMPOSITION

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United States of America Patent

APP PUB NO 20220162478A1
SERIAL NO

17669519

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The compositions of the present disclosure polish surfaces or substrates that at least partially include ruthenium. The composition includes a synergistic combination of ammonia and oxygenated halogen compound. The composition may further include abrasive and acid(s). A polishing composition for use on ruthenium materials may include ammonia, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; hydrogen periodate, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; silica, present in an amount of 0.01 wt % to 12 wt %, based on the total weight of the composition; and organic sulfonic add, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition, wherein the pH of the composition is between 6 and 8.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE NORTH KINGSTOWN RI 02852

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Bin Chandler, US 275 1156
Huang, Ting-Kai Taiwan (ROC), CN 25 56
Liang, Yannan Gilbert, US 23 6
Lin, David (Tawei) Chandler, US 4 6
Wen, Liqing (Richard) Mesa, US 4 6

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