PACKAGE PROCESS AND PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
May 19, 2022
app pub date -
Jan 11, 2022
filing date -
Jan 11, 2022
priority date (Note) -
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Abstract
A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.
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