APPARATUS FOR PLASMA PROCESSING AND PLASMA PROCESSING SYSTEM
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United States of America Patent
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Issued Date -
May 19, 2022
app pub date -
Nov 12, 2021
filing date -
Nov 12, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus for plasma processing comprises: a support configured to support a substrate and an edge ring disposed around the substrate; a lifting mechanism configured to vertically move the edge ring; and a controller. The support includes a convex portion which protrudes upward and on which the substrate is mounted, a ring mounting portion on which the edge ring is mounted in a state in which the convex portion is inserted into the hole of the edge ring, and a temperature adjustment mechanism configured to adjust a temperature of the convex portion. The lifting mechanism and the temperature adjustment mechanism are configured to move the edge ring to a predetermined position at which the convex portion is in a state of being inserted into the hole of the edge ring and heat the convex portion of the support to expand it in a diametric direction thereof.
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