SOLDERING COMPONENT AND METHOD OF ASSEMBLING SOLDERING COMPONENT TO OBJECT

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20220152716A1
SERIAL NO

17530473

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.

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Patent Owner(s)

Patent OwnerAddress
WANG TING JUINot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
WANG, TING-JUI New Taipei City, TW 228 318

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