COOLING DEVICES FOR COOLING ELECTRONIC COMPONENTS WITH LIQUID COOLING COMPONENTS
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United States of America Patent
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Issued Date -
May 12, 2022
app pub date -
Nov 10, 2020
filing date -
Nov 10, 2020
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Abstract
Cooling devices for cooling electronic components with liquid cooling and associated methods thereof are disclosed. According to an aspect, a device includes a housing that defines an interior space. The device also includes an electronic component positioned in the interior space. The device also includes a liquid cooling component configured to engage the housing and the electronic component for cooling the electronic component and the interior space.
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