Systems and methods for shielded inductive devices
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United States of America Patent
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Oct 31, 2023
Grant Date -
May 12, 2022
app pub date -
Jan 26, 2022
filing date -
Jan 30, 2018
priority date (Note) -
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Abstract
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
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