PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT
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United States of America Patent
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May 12, 2022
app pub date -
Feb 13, 2020
filing date -
Feb 13, 2020
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Abstract
The present invention is a photosensitive resin composition including an alkali-soluble resin (A), a polymerizable compound (B), a photoradical polymerization initiator (C), and a solvent (D), in which the polymerizable compound (B) contains at least one kind (B1) selected from a compound represented by the following formula (1) and a compound represented by the following formula (3), having specific Rs, and a content ratio of the compound (B1) contained in the photosensitive resin composition is 15 to 50% by mass. The photosensitive resin composition of the present invention can form a thick-film resist pattern having excellent sensitivity and resolution, and by using the thick-film resist pattern, a plated formed product can be miniaturized.
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