MULTI WIRE BONDING WITH CURRENT SENSING METHOD
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United States of America
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Issued Date -
May 5, 2022
app pub date -
Nov 5, 2020
filing date -
Nov 5, 2020
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Abstract
Implementations of a semiconductor package system may include a first bond wire bonded to a portion of a leadframe and to a pad of a semiconductor die, the first bond wire coupled to one of a power source or a ground; and a second bond wire bonded to the portion of the leadframe and to a control integrated circuit. The portion of the leadframe may form a current sense area and the control integrated circuit may be configured to use the second bond wire and the current sense area to measure a current flowing through the first bond wire during operation.
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