SEMICONDUCTOR DEVICE STRUCTURE
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United States of America
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Issued Date -
Apr 28, 2022
app pub date -
Jan 6, 2021
filing date -
Jan 6, 2021
priority date (Note) -
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Abstract
Semiconductor structures and the manufacturing method thereof are disclosed. An exemplary semiconductor structure according to the present disclosure includes a substrate having a p-type well or an n-type well, a first base portion over the p-type well, a second base portion over the n-type well, a first plurality of channel members over the first base portion, a second plurality of channel members over the second base portion, an isolation feature disposed between the first base portion and the second base portion, and a deep isolation structure in the substrate disposed below the isolation feature.
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