SYSTEM AND METHOD FOR LAMINATION OF PRINTED CIRCUIT BOARDS
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United States of America
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Issued Date -
Apr 28, 2022
app pub date -
Oct 28, 2020
filing date -
Oct 28, 2020
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Abstract
A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface; cleaning the planar pad, the cleaning including electrostatically removing particulates from the first and second surfaces of the planar pad; and attaching a first release film sheet to the first surface and a second release film sheet to the second surface, the release film sheets being attached to the first and second surfaces using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.
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