CONDENSATION DEVICE, FLUX RECOVERY DEVICE, SOLDERING DEVICE, WATER VAPOR REMOVING METHOD, FLUX RECOVERY METHOD AND SOLDER PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20220126236A1
SERIAL NO

17600567

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a condensation device capable of removing water vapor from a larger amount of gas without making a size larger than in related art. A condensation device 700 according to the present invention includes an outer cooling unit 720 including one or two or more inner tubes 722, an outer tube 724 located outside the one or two or more inner tubes 722, and a first flow path 726 through which a first cooling medium passes between the one or two or more inner tubes 722 and the outer tube 724.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIYAMA, Tsutomu Tokyo, JP 18 69

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