MULTILAYER WIRING SUBSTRATE
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United States of America
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Issued Date -
Apr 7, 2022
app pub date -
May 22, 2020
filing date -
May 22, 2020
priority date (Note) -
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Abstract
A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermosetting resin and having a wiring layer formed between each adjacent layers of the layers in a state in contact with the adjacent layers; a second wiring substrate made of a ceramic; and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other. At least a surface of the joining layer adjacent to the second wiring substrate is made of a thermoplastic resin.
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