SEMICONDUCTOR STRUCTURE
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United States of America
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Issued Date -
Mar 31, 2022
app pub date -
Dec 14, 2021
filing date -
Dec 14, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor structure includes a carrier, a bonding structure, a semiconductor stack, a supporting element and a bridge layer. The bonding structure is on the carrier and has an upper surface. The semiconductor stack is on the bonding structure. The supporting element is on the bonding structure and has a side wall. The bridge layer has a first portion directly connected to the supporting element, a second portion connected to the first portion and a third portion connected to the second portion. The second portion and the third portion of the bridge layer are suspended above the upper surface of the bonding structure. The first portion of the bridge layer directly contacts the side wall of the supporting element.
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