INTEGRATED PHOTONIC DEVICE WITH IMPROVED OPTICAL COUPLING
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United States of America
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Mar 24, 2022
app pub date -
Dec 2, 2021
filing date -
Dec 2, 2021
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Abstract
A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.
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