CIRCUIT BOARD TAPE AND JOINING METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 17, 2022
app pub date -
Jul 20, 2021
filing date -
Jul 20, 2021
priority date (Note) -
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Abstract
A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.
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