ACOUSTIC WAVE DEVICE, AND PREPARATION METHOD THEREFOR AND TEMPERATURE CONTROL METHOD THEREOF
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United States of America
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Mar 17, 2022
app pub date -
Nov 24, 2021
filing date -
Nov 24, 2021
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Abstract
An acoustic wave device and a preparation method therefor, and a temperature control method of the acoustic wave. The preparation method comprises: providing a first substrate and a second substrate (S110); forming an acoustic wave structure on the first substrate (S120); forming a temperature measuring resistor on the first substrate (S130); forming a TEC device on the second substrate (S140); and bonding the first substrate and the second substrate via metal fusion to produce the acoustic wave device (S150).
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