THREE-DIMENSIONAL MOUNTING STRUCTURE AND METHOD FOR MOUNTING THE SAME
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United States of America Patent
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Issued Date -
Feb 17, 2022
app pub date -
Aug 16, 2021
filing date -
Aug 16, 2021
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Abstract
A three-dimensional mounting structure includes a first mounting component, a second mounting component facing the first mounting component, a connecting layer disposed between the first mounting component and the second mounting component, a third mounting component, an adhesive layer, and a barrier sheet. The first mounting component includes a first end surface. The third mounting component is bonded on the first end surface through the adhesive layer. The connecting layer includes a second end surface close to the first end surface. The three-dimensional mounting structure can avoid the adhesive layer overflowing from the first end surface to the second end surface and improve the electronic product yield. A method for assembling the three-dimensional mounting structure is also disclosed.
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