INDUCTION-BASED SYSTEMS AND METHODS FOR JOINING SUBSTRATES
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United States of America Patent
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Issued Date -
Feb 17, 2022
app pub date -
Dec 19, 2019
filing date -
Dec 19, 2019
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Abstract
An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.
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