Electronic device module
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United States of America Patent
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Dec 13, 2022
Grant Date -
Feb 10, 2022
app pub date -
Oct 23, 2020
filing date -
Aug 7, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.
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