HIGH PERMITTIVITY AND LOW LEAKAGE DIELECTRIC THIN FILM MATERIALS

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United States of America

APP PUB NO 20220028621A1
SERIAL NO

17293558

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Abstract

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Provided is the dielectric response of atomic layer-deposited and annealed polymorphic BaTiO3 and BaTiO3—AlO3 bi-layer thin films based on nanocrystalline BaTiO3 containing the perovskite and hexagonal polymorphs. Also provided are BaTiCb films having tuned Curie temperatures. Also provide are nano-grained films, comprising: a BaTiO3 film component comprising a Ba/Ti ratio of between about 0.8 and 1.06, a transition temperature of the nano-grained film being dependent on the Ba/Ti ratio, and the nano-grained film exhibiting a diffused phase transition, optionally whereby a temperature density of a dielectric constant of the nano-grained film is minimized.

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DREXEL UNIVERSITY3141 CHESTNUT STREET PHILADELPHIA PA 19104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FALMBIGL, Mattias Syosset, US 2 0
GOLOVINA, Iryna S Philadelphia, US 4 1
PLOKHIKH, Aleksandr V Philadelphia, US 4 1
SPANIER, Jonathan E Bala Cynwyd, US 23 211

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