AIRLAID SUBSTRATES HAVING AT LEAST ONE BICOMPONENT FIBER

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20220025580A1
SERIAL NO

17311485

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An airlaid substrate includes at least one bicomponent fiber having a first region and a second region. The first region includes polypropylene and the second includes a blend of an ethylene-base polymer and an ethylene acid copolymer. The ethylene-base polymer has a density from 0.920 g/cm3 to 0.970 g/cm3 and a melt index (I2) from 0.5 g/10 min to 150 g/10 min. The ethylene acid copolymer includes the polymerized reaction product of from 60 wt % to 99 wt % ethylene monomer and from 1 wt % to 40 wt % unsaturated dicarboxylic acid comonomer, based on the total weight of the monomers in the ethylene acid copolymer. The ethylene acid copolymer having a melt index (I2) from 0.5 g/10 min to 500 g/10 min.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DOW GLOBAL TECHNOLOGIES LLC2040 DOW CENTER MIDLAND MI 48674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Lihua Shanghai, CN 126 604
Chen, Shenglong Shanghai, CN 7 14
Xu, Phil Shanghai, CN 1 0

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation