METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20220020591A1
SERIAL NO

17491692

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following:

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Patent Owner(s)

Patent OwnerAddress
SEMSYSCO GMBH5020 SALZBURG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Engesser, Philipp Villach, AT 12 88
Gleissner, Andreas Dobriach, AT 44 390
Knoll, Oliver Salzburg, AT 5 3
Markut, Franz St. Georgen, AT 6 3
Okom-Schmidt, Harald Klagenfurt, AT 1 0
Wirnsberger, Thomas Seeboden, AT 18 389

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