LOCALIZED RESISTANCE ANNEALING PROCESS
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United States of America
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N/A
Issued Date -
Jan 20, 2022
app pub date -
Nov 4, 2019
filing date -
Nov 4, 2019
priority date (Note) -
Published
status (Latency Note)
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Abstract
A localized annealing process and a part having localized areas with increased ductility produced by the process. The part is formed of hard material, tempered, and/or otherwise hardened such that it meets minimum hardness and ductility requirements. The part further includes localized areas that have increased ductility for workability, which could include various types of deformation. The localized annealing process includes providing a part with low levels of ductility and then annealing localized areas of the part for increased ductility that will need to be machined or attached to another formed part. The annealing process includes placing an electrode on either side of the localized area and generating electricity through the localized area. The material in the localized area is then heated from the electricity to form a more ductile physical structure.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MAGNA INTERNATIONAL INC | 337 MAGNA DRIVE AURORA L4G 7K1 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
deNIJS, Eric | Toronto, CA | 10 | 35 |
NIU, Xiaoping | Richmond Hill, CA | 11 | 6 |
PENNER, Pavlo | Woodbridge, CA | 3 | 1 |
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