Monitoring Method for Monitoring a Film Bubble in a Discharge Region Downstream of a Discharge Nozzle of a Blown Film Device
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United States of America
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Jan 20, 2022
app pub date -
Oct 2, 2019
filing date -
Oct 2, 2019
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Abstract
The invention relates to a monitoring method for monitoring a film bubble (FB) in a discharge region (112) downstream of a discharge nozzle (110) of a blown film device (100), comprising the following steps:
- optically detecting at least one contour parameter (KP) of a film contour (FK) of the film bubble (FB) in the discharge region (112),comparing the at least one detected contour parameter (KP) with a specific preset value (VW),determining a contour deviation (KA) between the at least one detected contour parameter (KP) and the specific preset value (VW),outputting the contour deviation (KA) as monitoring result (UE).
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