Cooling Arrangement
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Jan 13, 2022
app pub date -
Jul 7, 2021
filing date -
Jul 7, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A power electronic assembly a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.
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