CARRIER SUBSTRATE FOR ELECTRICAL, MORE PARTICULARLY ELECTRONIC, COMPONENTS, AND METHOD FOR PRODUCING A CARRIER SUBSTRATE
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United States of America
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Issued Date -
Dec 30, 2021
app pub date -
Sep 24, 2019
filing date -
Sep 24, 2019
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Abstract
A carrier substrate (1) that includes an insulation layer (11) and a metal layer (12), wherein a flank profile (2), in particular an etching flank profile, at least zonally borders the metal layer (12) in a primary direction (P) extending parallel to the main extension plane (HSE), wherein, viewed in the primary direction (P), the flank profile (2) extends from a first edge (15) on an upper side (31) of the metal layer (12), which faces away from the insulation layer (11), to a second edge (16) on a lower side (32) of the metal layer (12), which faces the insulation layer (11), characterized in that the flank profile (2), viewed in the primary direction (P), has at least one local maximum (21) and at least one local minimum (22).
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