RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT AND METAL-COATED LAMINATE
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United States of America
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Dec 30, 2021
app pub date -
Dec 25, 2018
filing date -
Dec 25, 2018
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Abstract
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
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