Thin Film Coating Packaging for Device Having Meltable and Wetting Links
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United States of America
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Dec 16, 2021
app pub date -
May 27, 2021
filing date -
May 27, 2021
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Abstract
A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.
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