METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
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United States of America
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Issued Date -
Dec 16, 2021
app pub date -
Jun 3, 2021
filing date -
Jun 3, 2021
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Abstract
A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.
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