COPPER POWDER FOR 3D PRINTING, METHOD FOR PRODUCING COPPER POWDER FOR 3D PRINTING, METHOD FOR PRODUCING 3D PRINTED ARTICLE, AND 3D PRINTED ARTICLE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20210387255A1
SERIAL NO

17295205

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Abstract

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The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 μm or more and 150 μm or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.

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Patent Owner(s)

Patent OwnerAddress
MEC COMPANY3-4-1 KUISE MINAMISHIMMACHI AMAGASAKI-SHI HYOGO 6600822

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IGAMI, Kaori Hyogo, JP 1 1
KATAYAMA, Daisuke Hyogo, JP 22 74
MIKI, Takao Osaka, JP 15 232
NAKAMOTO, Takayuki Osaka, JP 24 312
NAKAZAWA, Masato Hyogo, JP 3 53
SUGAHARA, Takahiro Osaka, JP 9 43
UCHIDA, Sohei Osaka, JP 6 40

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