Assembly and Method for Applying Solder Balls to a Substrate
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United States of America
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Issued Date -
Dec 9, 2021
app pub date -
May 15, 2018
filing date -
May 15, 2018
priority date (Note) -
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Abstract
Assembly for placing solder from solder balls on a substrate, comprising a reservoir with a plurality of solder balls, an exit opening for releasing one single solder ball, a feeding channel between the reservoir and the exit opening with a feeding channel width larger than the diameter of one solder ball and smaller than the diameter of two solder balls, and a suction channel with end opening into the feeding channel which end is smaller than the diameter of one solder ball. A pressure difference is generated between the feeding channel and the suction channel and is controlled whereby pressure in the suction channel is smaller than in the feeding channel. A solder ball present in the feeding channel can be sucked to and held to the end of the suction channel at a first pressure difference to block feeding of solder balls and is released at a second pressure difference.
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