Heat sink and circuit device
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United States of America Patent
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Jan 17, 2023
Grant Date -
Dec 2, 2021
app pub date -
Oct 18, 2018
filing date -
Oct 26, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.
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