METHOD OF ANALYZING STRAIN OF THIN FILM BY USING STC METHOD
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United States of America Patent
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Dec 2, 2021
app pub date -
May 29, 2020
filing date -
May 29, 2020
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Abstract
The present invention relates to a method of analyzing strain of a thin film by using a Strain Tensor Using Computational Fourier Transform Moiré (STC) method, and the method includes: receiving two Bragg peaks selected from a reciprocal lattice image obtained by Fourier transforming a two-dimensional (2D) lattice image of a thin film; shifting the two received Bragg peaks to an origin point of the reciprocal lattice image; calculating a moiré fringe pattern by Fourier-inverse-transforming the two Bragg peaks shifted to the origin point; calculating a strain tensor by differentiating the calculated moiré fringe pattern; and analyzing strain of the thin film by using the calculated strain tensor. The present invention, it is possible to obtain a considerably accurate strain analysis result with minimal errors even in the case where strain of a thin film is complex, and measure shear strain, as well as axial strain, of a thin film.
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