Method of dicing a semiconductor substrate having a scribe lane defined therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 25, 2023
Grant Date -
Nov 25, 2021
app pub date -
Aug 9, 2021
filing date -
Nov 22, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof. A fillet is arranged on at least one side surface of the conductive structure. The fillet is configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully