EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATING FILM, SEMICONDUCTOR DEVICE ENCAPSULATING FILM AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
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United States of America Patent
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Nov 25, 2021
app pub date -
May 12, 2021
filing date -
May 19, 2020
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An epoxy resin composition for semiconductor device encapsulation films, a film for encapsulation of semiconductor devices, and a semiconductor device encapsulated using the same, the epoxy resin composition including a liquid epoxy resin; a curing agent; about 2 wt % to about 10 wt % of a binder resin; and about 50 wt % or more of an oxide, a nitride, a carbide, or a hydroxide of gadolinium, boron, samarium, cadmium, or europium, all wt % being based on a total weight of the epoxy resin composition.
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