COPPER ELECTRODE MATERIAL
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United States of America Patent
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Issued Date -
Nov 18, 2021
app pub date -
Jan 6, 2020
filing date -
Feb 28, 2019
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Abstract
A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode material having improved corrosion resistance is provided by the copper electrode material.
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