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United States of America Patent
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Issued Date -
Nov 18, 2021
app pub date -
Aug 20, 2020
filing date -
May 18, 2020
priority date (Note) -
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Abstract
This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.
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