Substrate with cut semiconductor pieces having measurement test structures for semiconductor metrology

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11978679
APP PUB NO 20210351089A1
SERIAL NO

17306058

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Abstract

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A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective instance of a measurement test structure and an alignment mark. Each piece of the plurality of pieces has a known location from the one or more semiconductor wafers.

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Patent Owner(s)

Patent OwnerAddress
KLA CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dror, Chen Tivon, IL 4 30

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