COATING MATERIAL, CONVERSION MATERIAL, OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A COATING MATERIAL
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United States of America Patent
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Nov 11, 2021
app pub date -
Oct 1, 2019
filing date -
Oct 11, 2018
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Abstract
An enveloping material for an optoelectronic semiconductor chip is specified having —a starting material for forming a sol-gel material, and —a stabilizer material, configured for mechanical stabilization, wherein —the starting material comprises at least one alkoxy (alkyl)silane, and —the stabilizer material is selected from a group containing the following materials: salts, metal alkoxides, metal oxides. Furthermore, a conversion material and an optoelectronic component having such an enveloping material are specified. Additionally, a method for producing an enveloping material is specified.
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