Methods and systems for manufacturing pillar structures on semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11735549
APP PUB NO 20210343670A1
SERIAL NO

17376934

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing a semiconductor device having a conductive substrate having a first surface, a second surface opposite the first surface, and a passivation material covering a portion of the first surface can include applying a seed layer of conductive material to the first surface of the conductive substrate and to the passivation material, the seed layer having a first face opposite the conductive substrate. The method can include forming a plurality of pillars comprising layers of first and second materials. The method can include etching the seed layer to undercut the seed layer between the conductive substrate and the first material of at least one of the pillars. In some embodiments, a cross-sectional area of the seed layer in contact with the passivation material between the first material and the conductive substrate is less than the cross-sectional area of the second material.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 SOUTH FEDERAL WAY BOISE ID 83716-9632

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fay, Owen R Meridian, US 120 968
Huang, Wayne H Boise, US 17 85
Jebaraj, Adriel Jebin Jacob Boise, US 5 9
Vadhavkar, Sameer S Boise, US 34 385
Yeruva, Suresh Boise, US 4 9

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