Embedded component package structure having a magnetically permeable layer
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United States of America Patent
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Aug 1, 2023
Grant Date -
Nov 4, 2021
app pub date -
Jul 12, 2021
filing date -
Jul 31, 2019
priority date (Note) -
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Abstract
A semiconductor device package includes a magnetically permeable layer having a top surface and a bottom surface opposite to the top surface. The semiconductor device package further includes a first conductive element in the magnetically permeable layer. The semiconductor device package further includes a first conductive via extending from the top surface of the magnetically permeable layer into the magnetically permeable layer to be electrically connected to the first conductive element. The first conductive via is separated from the magnetically permeable layer. A method of manufacturing a semiconductor device package is also disclosed.
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