Integrated circuit / printed circuit board assembly and method of manufacture
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United States of America Patent
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Feb 20, 2024
Grant Date -
Oct 28, 2021
app pub date -
Jul 7, 2021
filing date -
Nov 26, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.
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