METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES
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United States of America Patent
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Issued Date -
Oct 21, 2021
app pub date -
Jun 29, 2021
filing date -
Nov 28, 2014
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Abstract
A method of manufacturing a structure having conductive lines is disclosed by forming a patterned catalyst material layer on a substrate; activating the patterned catalyst material layer to form an activated patterned catalyst material layer including activated catalysts; and growing a conductive layer on the activated catalysts of the activated patterned catalyst material layer. The patterned catalyst material layer is formed from a catalyst material including 40 wt % to 90 wt % of polymer and 10 wt % to 60 wt % of catalyzer. An uppermost portion of the activated patterned catalyst material layer includes the activated catalysts, and the activated catalysts include metal reduced from the catalyzer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The structure of the conductive line of the disclosure has the characteristics of high conductivity.
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