Method of manufacturing quartz crystal element
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United States of America Patent
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Oct 8, 2024
Grant Date -
Oct 21, 2021
app pub date -
Apr 13, 2021
filing date -
Apr 15, 2020
priority date (Note) -
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Abstract
A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.
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