LEVERAGED POROMERIC POLISHING PAD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20210323115A1
SERIAL NO

16852418

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a porous polyurethane polishing pad that includes a porous matrix. The matrix has large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with tertiary pores, a portion of the large pores is open to a top polishing surface and at least a portion of the large pores extend to the top polishing surface. Spring-arm sections connect lower and upper sections of the large pores. The spring-arm sections all are in a same horizontal direction as measured from the vertical orientation and they combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONIC MATERIALS HOLDING INC451 BELLEVUE ROAD NEWARK DE 19713

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Hui Bin Monroeville, US 6 3
KAWABATA, Katsumasa Kyoto, JP 12 31
TAKEI, Yosuke Shimane, JP 9 45
TSAI, Wei-Wen Philadelphia, US 20 6
UEHARA, Akane Kyoto, JP 4 0

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