HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
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United States of America Patent
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Issued Date -
Oct 14, 2021
app pub date -
Apr 13, 2020
filing date -
Apr 13, 2020
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status (Latency Note)
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Abstract
A semiconductor device package includes a leadframe, and a heatsink bonded to the leadframe. A semiconductor device may be mounted using the leadframe and positioned such that heat generated by the semiconductor device is conducted by the heatsink, with molding that encapsulates the leadframe, the heatsink, and the semiconductor device.
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