CORROSION INHIBITION SYSTEM PRIMERS AND ADHESIVES FOR METAL BOND STRUCTURES

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United States of America Patent

APP PUB NO 20210309886A1
SERIAL NO

17198969

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Abstract

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A method of forming an adhesively bonded structure may comprise applying a primer compound to a first substrate, wherein the primer compound comprises a functionalized nanomaterial dopant, drying the primer compound on the substrate to form a primer layer comprising the functionalized nanomaterial dopant, applying an adhesive compound over the primer layer to form an adhesive layer, wherein the adhesive compound comprises the functionalized nanomaterial dopant, contacting the adhesive layer with a second substrate and curing the adhesive layer to form an adhesively bonded structure, wherein the first substrate is metallic and the second substrate is at least one of metallic or composite.

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ROHR INC850 LAGOON DRIVE CHULA VISTA CA 91910-2098

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  • 2021 Application Filing Year
  • C09J Class
  • 1188 Applications Filed
  • 326 Patents Issued To-Date
  • 27.45 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Poteet, Steven A Hamden, US 27 75
PUJAR, Vijay V Rancho Santa Fe, US 77 197
Smith, Blair A South Windsor, US 87 296

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges16557201 - 1011 - 200102030405060708090100110120130140150160170180

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